Academic Achievements
A Novel and Unified Full-Chip CMP Model Aware Dummy Fill Insertion Framework With SQP-Based Optimization Method
Dec 16, 2021 |
  • Journal:
     IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
  • Document Code:
     HS4372
  • Volume:
     40
  • Issue:
     3
  • Page Number:
     603-607
  • Translation or Not:
     no
  • Date of Publication:
     Jan 1, 2021