Academic Achievements
A Novel and Unified Full-Chip CMP Model Aware Dummy Fill Insertion Framework With SQP-Based Optimization Method
Dec 30, 2021 |
  • Journal:
     2018 55TH ACM/ESDA/IEEE DESIGN AUTOMATION CONFERENCE (DAC)
  • Document Code:
     SY133915
  • Volume:
     Part F137710
  • Translation or Not:
     no
  • Date of Publication:
     Jan 1, 2018