Investigation of ultra-thin Al2O3 film as Cu diffusion barrier on Low-k (k=2.5) dielectrics
- 点击次数：
- 发表刊物：2011 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE AND MATERIALS FOR ADVANCED METALLIZATION (IITC/MAM)
- 论文编号：SR3285
- 是否译文：否
- 发表时间：2011-01-01
- 发表时间：2011-01-01
